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10 layers FR4 ENIG PCB Circuit Board Manufacturing with golden finger

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10 layers FR4 ENIG PCB Circuit Board Manufacturing with golden finger

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Brand Name : KAZ Circuit

Model Number : PCB-B-041931

Certification : ISO9001, TS16949, UL, RoHS

Place of Origin : China

MOQ : 1 pc

Price : USD/pc

Payment Terms : T/T, Western Union, Paypal

Supply Ability : 20,000 Square Meters / Month

Delivery Time : 2~3 weeks

Packaging Details : Bubble Wrap

Categary : Multilayer PCB

Material : FR-4

Layers : 10 layers

Board Thickness : 1.6mm

Copper : 1oz

Surface : ENIG

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10 layers FR4 ENIG PCB Circuit Board Manufacturing with golden finger​

 

 

Detail Specifications:

 

 Layers  10
 Material  FR-4
 Board Thickness  1.6mm
 Copper Thickness  1oz
 Surface Treatment  HASL
 Soldmask & Silkscreen  Green & White
 Quality Standard  IPC Class 2, 100% E-testing
 Certificates  TS16949, ISO9001, UL, RoHS

 
 

 

What KAZ Circuit can do for you:

 

  • PCB & PCBA Design
  • PCB manufacturing (prototype, small to medium, mass production)
  • Components Sourcing
  • PCB Assembly/SMT/DIP

 


To get a full quotation of the PCB/PCBA, pls provide the information as below:

 

  • Gerber File, with detail specification of the PCB
  • BOM List (Better with excel fomart)
  • Photoes of the PCBA (If you have done this PCBA before)

 


Company Informaiton:


    KAZ Circuit is a professional PCB manufacturer from China since 2007, also provide PCB Assembly service for our customers. Now with about 300 employees. Certified with ISO9001,TS16949, UL, RoHS. We are confident to provide you quality products with factory-directed price within the fastest delivery time!

 


 

Manufacturer Capacity:
 

Capacity Double Sided: 12000 sq.m / month
Multilayers: 8000sq.m / month
Min Line Width/Gap 4/4 mil (1mil=0.0254mm)
Board Thickness 0.3~4.0mm
Layers 1~20 layers
Material FR-4, Aluminum, PI
Copper Thickness 0.5~4oz
Material Tg Tg140~Tg170
Max PCB Size 600*1200mm
Min Hole Size 0.2mm (+/- 0.025)
Surface Treatment HASL, ENIG, OSP

 

 

SMT Capacity

 

10 layers FR4 ENIG PCB Circuit Board Manufacturing with golden finger

 

Multilayer PCB


    Multilayer PCB is a printed circuit board made of more than two layers of copper foil. It consists of an inner copper foil, an insulating substrate and an outer copper foil, and the interconnection between the layers is achieved by drilling and copper plating. Compared with single-layer or double-layer PCBs, multilayer PCBs can achieve higher wiring density and complex circuit design.

 

Advantages of multi-layer PCBs:

    Higher wiring density and complex circuit design capabilities
    Better electromagnetic compatibility and signal integrity
    Shorter signal transmission paths, improved circuit performance
    Higher reliability and mechanical strength
    More flexible power and ground distribution


Composition of multi-layer PCBs:

    Inner copper foil: Provides conductive layer and wiring
    Insulating substrate (FR-4, high-frequency low-loss dielectric, etc.): Isolates and supports each copper foil layer
    Outer copper foil: Provides surface wiring and interface
    Perforated metallization: Realizes electrical connection between layers
    Surface treatment: HASL, ENIG, OSP and other surface treatment processes


Design and manufacture of multi-layer PCBs:

    Circuit design: Signal integrity, power/ground integrity design of multi-layer boards
    Layout and wiring: Reasonable layer allocation and routing optimization
    Process design: Aperture size, layer spacing, copper foil thickness, etc.
    Manufacturing process: Lamination, drilling, copper plating, etching, surface treatment, etc.

 

 

More photoes of this 10 layers FR-4 ENIG High Tg PCB Circuit Board Manufacturing with golden finger

10 layers FR4 ENIG PCB Circuit Board Manufacturing with golden finger

10 layers FR4 ENIG PCB Circuit Board Manufacturing with golden finger

10 layers FR4 ENIG PCB Circuit Board Manufacturing with golden finger


Product Tags:

rigid flex pcb

      

pcb printed circuit board

      
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